Laminating Equipment Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Laminating Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. ナップ工業 Osaka//Building materials, supplies and fixtures manufacturers
  2. null/null
  3. 長野オートメーション Nagano//others
  4. 4 松下工業 Osaka//others
  5. 4 テクノライズ株式会社 Kanagawa//others
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Laminating Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Protective film lamination system ナップ工業
  2. Double-sided tape bonding machine "PRORAMI"
  3. Precision Automatic Bonding Device (Optical Films, etc.) 長野オートメーション
  4. Precision Bonding Device (Semi-Automatic) 長野オートメーション
  5. 4 Disk Bonding Device DVD Bonding System 松下工業

Laminating Equipment Product List

1～8 item / All 8 items

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Precision Automatic Bonding Device (Optical Films, etc.)

Precision Automatic Bonding Device (Optical Films, etc.)

Design and manufacture of equipment for precision lamination of optical films tailored to customer requirements.

In addition to bonding, we also support various specialized machines. Please feel free to consult us about automatic assembly machines, screw tightening machines, coating machines, specialized processing machines, transfer machines, glass handling equipment, battery manufacturing equipment, and any other specialized equipment.

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Precision Bonding Device (Semi-Automatic)

Precision Bonding Device (Semi-Automatic)

Precision Bonding Device (Semi-Automatic)

This device is used for manually positioning and bonding two substrates, such as glass substrates and optical film substrates. In recent years, the demand for thinner bonded products and higher levels of appearance accuracy has increased. We have consolidated our bonding technology (speed and pressure control mechanisms) into a space-saving device, achieving high-quality bonding without scratches or bubbles.

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Disk Bonding Device DVD Bonding System

Disk Bonding Device DVD Bonding System

Since its development in 1981, it has been exported to various countries in Europe and America.

Since developing the world's first LD (Laser Disc) bonding machine in 1981, we have supplied bonding machines for LD (Laser Disc), MO (Magnetic Optical Disc), and PD (Phase Change Disc) to the United States, Europe, and around the world. Based on that technology, the TECMIC DVD Bonding System, which was developed, boasts the production of DVD-R, DVD-RAM, and DVD-ROM (DVD-5, DVD-10) with low cost and high productivity.

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Vacuum bonding device (bonding apparatus) VAP250

Vacuum bonding device (bonding apparatus) VAP250

We provide bonding equipment that enables ultra-precision lap processing and polishing processing!!

In order to address the demands for microfabrication and the diversified ultra-high precision requirements sought in today's processing technology, we will support your development and production line with a bonding device as a necessary work temporary fixation method in the ultra-high precision processing process that enables further precision pursuit while utilizing the current lap and polish processing line.

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Protective film lamination system

Protective film lamination system

We propose a protective film application system tailored to your needs!

This is an announcement from Nappu Industrial Co., Ltd. regarding the protective film laminating system. Double-sided laminating machine Upper side: 4-axis reversible Lower side: 2-axis

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Vacuum Bonding Device VSP300

Vacuum Bonding Device VSP300

We offer bonding equipment that enables ultra-precision lap processing and polishing processing!!

In order to address the demands for fine processing and diversified ultra-high precision requirements sought in today's processing technology, and while utilizing the current lap and polish processing line to enable further precision pursuit, we will support your development and production line with a bonding device as a necessary work temporary fixation method in the ultra-high precision processing process.

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Vacuum bonding device

Vacuum bonding device

Realizing next-generation manufacturing processes with a vacuum bonding device.

The vacuum lamination device is a machine that allows you to place the target workpiece you want to laminate into a chamber and create a vacuum state within the chamber to press the target under vacuum (diaphragm method). 【Capabilities】 Lamination Curved surface lamination Molding Sealing 【Use Cases】 Perovskite solar cells Space solar cells Micro LED displays 【Product Lineup】 We offer a wide range of sizes from a minimum of 200mm square (desktop type) to a maximum of 2M x 5M large sizes. The pressing pressure can be adjusted from atmospheric pressure (standard) to a maximum of 7 atmospheres (optional). Typically, shipping preparations are completed about 7 months after placing an order, and on-site confirmation is possible. 【Demo Testing in Progress】 You can use a test vacuum lamination device for prototyping and evaluation tests at our factory in Matsuyama City, Ehime Prefecture. We will propose the optimal recipe and pressing method tailored to the materials and specifications. Additionally, we can accommodate automation of the upstream and downstream processes (such as material supply and stacking processes) of the device. Please feel free to contact us for more details.

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